What is Mulpin ?
The Mulpin concept is to embed components, both active and passive, into multi-layered Printed Circuit Boards (PCBs). By embedding all Mulpin components within the PCB, we eliminated all the common problems associated with surface-mounted components by removing exposure to the elements.
PCB’s traditionally are manufactured by soldering electronic components such as transistors, resisters, memory chips, capacitors etc to tracks on the surface of a board. Mulpin components however are different as they are mounted within the board via an opening into the PCB from its top surface. Thus the connections for any given component can be made to multiple layers of the PCB including the top and bottom surface layers, thus spreading them vertically into the PCB as well as horizontally around the perimeter of a component.
An example of a 3 layer Mulpin component embedded within a multi layer board will result in a component three times smaller than the conventional type, but it occupies three layers of the PCB instead of one. This results in smaller components and smaller PCB’s. Furthermore Mulpin technology requires no changes to the current PCB manufacturing process.
History of Mulpin
As a designer of High Frequency Radio equipment for over 40 years (with the last 20 years designing Military communication devices), Mulpin lead inventor Mr. Rodney Green found difficulties in sufficiently isolating one stage of a radio system from another, this can cause problems with interference generated within the equipment, thus reducing the effectiveness of the communication system at some frequencies. It’s an extremely time consuming process to identify and remove such problems. This would usually involve design compromises and more often than not external shielding on the Printed circuit Board used in the system required. This would involve considerable extra design time, with added expense to production.
Evolution of Mulpin
It was then I thought that it may be possible to bury the components within a PCB and shield them from each other using the copper cladding on the PCB. Burying conventional components had already been tried, but it was messy and expensive.
I devised a way to change electronic components in such a way that made burying the components possible without the need to modify current PCB production methods. Coincidentally the components would also become self shielding against Radio Frequency Interference and indeed even Electro Magnetic Pulse, (EMP) generated by high altitude nuclear weapons, powerful microwave transmitters and other man made devices which could be used to destroy important electronic equipment and infrastructure during warfare and or terrorist attack. They would also be shielded against natural incidences of EMP from space which can damage satellite circuitry.
We soon discovered after our first Prototypes were built by “Mulpinising” existing components and inserting these into the new format PCB’s to test that their performance exceeded our expectations with regard to EMP screening and heat dissipation. These PCB’s were built in a conventional PCB factory with no difficulty. This should ensure that the Mulpin system will start a new industrial revolution within the PCB and Component industries worldwide.
A second batch of prototypes were built which were able to withstand being placed in a microwave oven and into a one million Volt spark from a Tesla coil. The test results from these prototypes can be seen by clicking on Intellectual property and then Test results on this site.
More detail can be obtained by sending an email to the inventors at the following address:- firstname.lastname@example.org
The components which use this system can be both active and passive, and the inventors have claimed several advantages over currently produced components. These include;
- Greatly improved heat dissipation to the PCB substrate.
- Lower temperature operation for given component size means smaller components, and thus less PCB space used for a given circuit.
- More pins (connections) for a given component footprint, meaning smaller components.
- Greater internal electrical screening means less internally generated interference in radio and other sensitive systems.
- Shorter design time aids in cost reduction, particularly for smaller production runs where design time can be a significant portion of final product price.
- Faster operating speed, due to low lead inductance on parts designed for very high speed operation.
- Components are self screening from RFI/EMI.
- Greater immunity to EMI/RFI and EMP to and from all sources, at component and system level.
- Mulpin PCBs are water, vibration and dust proof which increases their use in many fields previously limited by conventional PCBs.
- Considerably better security of data on a Mulpin system as it is extremely difficult or even impossible to reverse engineer due to the inherent buried nature of Mulpin parts where required.
- Better component reliability due to lower temperature fluctuations between on and off times.
- No need to change current PCB manufacturing techniques.
- Perfect mechanical and electrical symmetry is possible with balanced radio frequency circuits such as mixers, push pull amplifiers, and frequency multipliers, extending the upper frequency limit of these circuits.
- Components especially suited to the Military and aerospace, but are most likely to appear in all electronic circuits in due course. For more information and other advantages please contact: - email@example.com
For further information please email firstname.lastname@example.org
Rodney Green - Director, Lead Inventor and Head of R & D: Rodney’s 40 + years in the electronics industry have been marked by highly innovative PCB design capabilities, Electronic design skills with many inventions from electronic portable hypodermic needle furnace which was exported to Japan and his well known international publicised Dirodyne radio architecture. He has written many articles of ground breaking concepts that are being used in the international market place. His skills have gained Rodney a well deserved reputation throughout the industry. email@example.com
Perry Kelly - Director and CEO: Since 1970 Perry has been in managerial roles initially within the office equipment industry. His expertise has been in management & sales training. His other areas of expertise are in marketing. In the last decade his focus has been in the commodity markets and has gained a great deal of experience in international negotiations. In addition he is involved within the IT industry, specifically in payment systems firstname.lastname@example.org
Kevin Bellette - Director and Co-Founder: Kevin is one of 3 co-founders and a director of Mulpin Research Laboratories Limited. Before co-founding MRLL, Kevin was an Authorised Asia Office Partner with St Andrews securities, which included Stock Listing, Corporate Finance and Capital Raising. email@example.com
Gareth Harvey - Assistant Inventor & 2IC R & D: Gareth Harvey specialises in audio and digital electronic design, including hardware and software design. He has had many years focused in the radio communications sector and is a Bachelor of Electronics and Communications Engineering. Gareth brings a wealth of expertise to the Company. firstname.lastname@example.org
Craig Matheson - Technical Adviser: Craig started his electronics career with the military in the early 80’s and for the past 10 years with an international military supply company as Manager of Electrical Engineering Division and is a Bachelor of Engineering in Electrical Engineering and has an Associate Diploma of Electrical Engineering. email@example.com
Bernard Hoey - Chief Finance Controller & Company Accountant: Bernard is a partner in the accountancy firm “Burswood Partners” (formerly Roper Hoey) for 25 years. He has extensive experience in consulting with businesses in a wide range of matters including: Taxation • Positioning businesses for ultimate sale • Financing transactions. Bernard’s entrepreneurial approach to tasks has been useful in finding innovative solutions to a variety of business problems experienced by corporate clients. He is a Certified Practising accountant and a fellow of the Taxation Institute of Australia. firstname.lastname@example.org
Joseph Stecewycz – Mulpin’s Patent Attorney/Legal Council: Joseph is a patent attorney currently in private practice in the US prosecuting electrical, software, and mechanical patent applications. He has been employed at three of the patent law firms in the Boston area, and has also served as patent counsel for the Polaroid Corporation. Prior to his legal practice, he worked as an electrical/systems engineer in the defense industry, testing and modifying aircraft electronics and missile radar systems. In addition to his legal background, Joseph also holds degrees in engineering and physics. email@example.com
Paul Stewart – Mulpin’s Lead Licensing Professional: Paul is the Managing Director of PASCO Ventures LLC located in Indianapolis USA. He is a Certified Licensing Professional and is listed in “Who’s Who in America,” “Who’s Who in the World” and “Who’s Who in Medicine and Healthcare.” Paul Stewart received a Bachelor of Science degree in agricultural business management in 1976 from Purdue University, and a Master of Business Administration degree from Harvard University School of Business in 1987. Is President and Chairman of the Board of Governors of the “Certified Licensing Professionals” organization, and on the Advisory Board of DePauw University’s Management. firstname.lastname@example.org
Peter Kasprzak – Business Development Manager: Peter Kasprzak is an innovator and entrepreneur with expertise in sales, marketing, and business development. Over his career Peter gained experience in United States and Australia in fields of emerging technology, automotive industry, energy and environment. Peter is the co-founder of Innovate Australia and immediate past President of Inventors Association of Australia. He is the co-founder and Director of a geophysics company and board member of Australian Solar Council WA. His previous directorships included a roadside assistance provider, electric vehicle charging supplier, and a national crime prevention organisation. Peter also headed WA bid group to create Sustainable Electric Transport Cooperative Research Centre (SET CRC) in Western Australia. email@example.com
Adam Osseiran – Senior Technical Manager: Adam Osseiran has been involved with advanced electronic and microelectronic technologies for the last 30 years in both industry and academia. He is the director of a national project relating to the Australian semiconductor industry. With a PhD in microelectronics, President of Inventors Association of Australia WA. Adam has co-founded three companies with advanced sensing technology for environmental monitoring and the emerging Internet of Things (IoT) markets. firstname.lastname@example.org
Lam Truong – Manager Commercialisation Licensing & Manufacturing: Lam has a Masters of Electronic Engineering. He is extremely qualified in business development, technological & marketing research, PCB design and software development, production quality assurance & control, concept design to full production, Electronic Systems Engineer. Lam has also published a number of conference papers including “Micro Engineered Accelerometers” and speaks fluent English & Chinese. email@example.com
Anthony Leung – Technical & Marketing Advisor: Anthony Leung holds a Bachelor’s Degree (Major) in Electronics Engineering and resides in Hong Kong. His speciality is Electronic components I.C & Sensors, Telecommunication Instruments and accessories for Optical Fibre, Data transmission architecture in remote control system. Circuit and new product design (Electronic & Electrical) and vast experience in Sales & Marketing. firstname.lastname@example.org
Christopher Gabriel – Assistant Finance Controller: Christopher Gabriel’s career is focused on finance, marketing, entrepreneurship, and customer experience management. Has a Master of Business in Applied Finance and a Masters in Business Administration. email@example.com
Board of Management
Rodney Green - Director - Lead Inventor and Head of R & D: Rodney’s 40 + years in the electronics industry have been marked by highly innovative PCB design capabilities, Electronic design skills with many inventions from electronic portable hypodermic needle furnace which was exported to Japan and his well known international publicised Dirodyne radio architecture. He has written many articles of ground breaking concepts that are being used in the international market place. His skills have gained Rodney a well deserved reputation throughout the industry. firstname.lastname@example.org
Perry Kelly – Director and CEO: Since 1970 Perry has been in managerial roles initially within the office equipment industry. His expertise has been in management & sales training. His other areas of expertise are in marketing. In the last decade his focus has been in the commodity markets and has gained a great deal of experience in international negotiations. In addition he is involved within the IT industry, specifically in payment systems. email@example.com
Kevin Bellette - Director and Co-Founder: Kevin is one of 3 co-founders and a director of Mulpin Research Laboratories Limited. Before co-founding MRLL, Kevin was an Authorised Asia Office Partner with St Andrews securities, which included Stock Listing, Corporate Finance and Capital Raising. firstname.lastname@example.org
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Terms & Conditions - Offer Document
Mulpin Research Laboratories Limited makes no representation about the underlying value of the securities on offer. Prospective investors must make their own assessment about whether the price of the securities being offered represents fair value.
a) Investment in new business carries high risks. It is highly speculative and before investing in any project about which information is given, prospective investors are strongly advised to take appropriate professional advice;
b) The information contained in this publication has been prepared by Steppingstone Funding Pty Ltd on behalf of the Company and have not undertaken an independent review of the information contained in this publication;
c) The information contained in this publication about the proposed business opportunity and the securities or scheme interests is not intended to be the only information on which the investment decision is made and is not a substitute for a disclosure document, Product Disclosure Statement or any other notice that may be required under the Corporations Act, as the Act may apply to the investment.
d) Detailed information may be needed to make an investment decision, for Mulpin Research Laboratories Limited financial statements; a business plan; information about ownership of intellectual or industrial property; or expert opinions including valuations or auditors’ reports;
e) Prospective investors should be aware that no established market exists for the trading of any securities or scheme interests that may be offered; and
The information contained in the Offer Document about the proposed business opportunity and the securities or scheme interests is not intended to be the only information on which the investment decision is made and is not a substitute for a disclosure document, Product Disclosure Statement or any other notice that may be required under the Act, as that Act may apply to the investment.
Detailed information may be needed to make an investment decision, for Mulpin Research Laboratories Limited: financial statements; a business plan; information about ownership of intellectual or industrial property; or expert opinions including valuations or auditors’ reports.
A prospective investor is strongly advised to take appropriate professional advice before accepting an offer for issue or sale of any securities or scheme interests.
The information contained in this Offer Document (“Offer Document”) is being provided to the recipient solely for the purpose of evaluating an investment in Mulpin Research Laboratories Limited ACN 154 714 011 (“MRLL” or the “Company”).
In consideration of MRLL providing this Offer Document to the recipient, the recipient acknowledges that the contents of this Offer Document are confidential to the Company and the recipient agrees not to disclose, distribute or permit to be communicated verbally, directly or indirectly or otherwise, or to otherwise publish the contents of this Offer Document except with the prior written consent of the Company. For the purposes of this acknowledgement “recipient” includes, without limitation, any principal, director, officer, shareholder, employee or agent of the recipient.
Any reproduction or distribution of the Offer Document, in whole or in part, or any disclosure of its contents, or use of any information contained in this Offer Document for any purpose other than to evaluate an investment in the Company, is prohibited.
The information contained in this Offer Document or subsequently provided to the recipient whether orally or in writing by, or on behalf of the Company or any of their respective related bodies corporate or any of their respective directors, officers, employees, agents, representatives and advisers (“Parties”) is provided to the recipient on the terms and conditions set out in this notice.
The Offer Document provides a summary of the main features of the Company.
It has been prepared without taking into account any investor’s objectives, financial situation or needs. Investors should read the Offer Document carefully and assess whether the information is appropriate for them in respect of their objectives, financial situation and needs, and seek professional advice, if necessary.
The Offer Document does not purport to contain all the information that a prospective investor may require. In all cases, interested parties should conduct their own investigation and analysis of the Company and the data contained in this Offer Document.
To the full extent permitted by law:
(a) no representation or warranty (express or implied) is given; and
(b) no responsibility or liability (including in negligence) is accepted, by the Parties as to the truth, accuracy or completeness of any statement, opinion, forecast, information or other matter (whether express or implied) contained in the Offer Document or its attachments or as to any other matter concerning them.
To the full extent permitted by law, no responsibility or liability (including in negligence) is accepted by the Parties:
(a) for or in connection with any act or omission, directly or indirectly in reliance upon; and
(b) for any cost, expense, loss or other liability, directly or indirectly, arising from, or in connection with, any omission from or defects in, or any failure to correct any information, in this Offer Document or any other communication (oral or written) about or concerning them, or the issue of securities in the Company.
The delivery of the Offer Document does not under any circumstances imply that the affairs or prospects of the Company or any information affecting it have been fully or correctly stated in this Offer Document or have not changed since the date of this Offer Document or since the date at which the information is expressed to be applicable.
No responsibility or liability (including in negligence) is assumed by the Parties for updating any such information or to inform the recipient of any new information of which the Parties may become aware.
The Company makes no representation about the underlying value of the securities on offer. Prospective investors must make their own assessment about whether the price of the securities being offered represents fair value.
Except for historical information, there may be matters in this publication that are forward-looking statements. Such statements are only predictions and are subject to inherent risks and uncertainty. Forward-looking statements, which are based on assumptions and estimates and describe the Company’s future plans, strategies, and expectations are generally identifiable by the use of the words ‘anticipate’, ‘will’, ‘believe’, ‘estimate’, ‘plan’, ‘expect’, ‘intend’, ‘seek’, or similar expressions. Investors are cautioned not to place undue reliance on forward-looking statements. By its nature, forward-looking information involves numerous assumptions, inherent risks and uncertainties both general and specific that contribute to the possibility that predictions, forecasts, projections and other forward-looking statements will not occur. Those risks and uncertainties include factors and risks specific to the industry in which the Company operates as well as general economic conditions and prevailing exchange rates and interest rates. Actual performance or events may be materially different from those expressed or implied in those statements.
All forward-looking statements attributable to the Company or persons acting on behalf of the Company are expressly qualified in their entirety by the cautionary statements in this section.
Except as expressly required by the Act, the Company undertakes no obligation to publicly update or revise any forward-looking statements provided in this publication whether as a result of new information, future events or otherwise, or the risks affecting this information.
None of the Company, its officers or any person named in this publication with their consent, or any person involved in the preparation of this publication, makes any representation or warranty (express or implied) as to the accuracy or likelihood of fulfilment of any forward-looking statement except to the extent required by law. The forward-looking statements reflect the views held only as at the date of this Offer Document.
The Company has supplied the content (text, pictorials, diagrams and photographs) contained in this Offer Document, but makes no representations as to its accuracy. Prospective investors are urged to make further enquiry about this investment, as well as seek appropriate professional advice before investing.
FOR PURPOSE OF OFFER ONLY
The Offer Document has been prepared by the Company for the purposes of the Offer and is provided by the Company to the recipient solely for information purposes for use by persons considering participation in the Offer. It does not, nor does it purport to, contain all the information that an investor may require to evaluate the Company and an Offer under this Offer Document.
The provision of this Offer Document is not and should not be considered as a recommendation in relation to an investment in the Company or that an investment in the Company is a suitable investment for the recipient.
This Offer Document does not purport to provide all of the information the recipient may require in order to evaluate an investment in the Company. Recipients should make their own enquiries and evaluations they consider appropriate to verify the information contained in this Offer Document and to determine the suitability of an investment in the Company (including regarding their investment objectives, financial situation, and particular needs) and should seek all necessary financial, legal, tax and investment advice. The Company does not accept any responsibility for any costs incurred by any person in relation to the person’s evaluation of the Company and the Offer under this Offer Document or otherwise.
Any offer of securities of the Company contained in this Offer Document is an offer of securities which does not require disclosure to investors under Part 6D.2 of the Act and is therefore only open to Sophisticated Investors, Professional Investors and other investors to whom an offer can be made under Part 6D.2 of the Act without the need for a disclosure document.
Please complete the form below if you still want to download Mulpin Research Laboratories Limited’s Offer Document.
Once you’ve completed and submitted the form below we will send a copy of the Mulpin Research Laboratories Limited Offer Document to your nominated email address within 24 hours.
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Invitation to Participate in the Acquisition of the Mulpin Patent Portfolio. Click to Read More
Allied Security Trust (AST) Has Accepted Via Patent Syndication Patent Portfolio Lot 4868
Mulpin receives US Patent Number - US8649183
Mulpin receives Notice of Allowance from USPTO
Mulpin has entered the PCT National Phase in Australia, Canada, India, Israel, Malaysia, Singapore & the European Union.
Mulpin Research Laboratories Limited Independent Patent Valuation is available upon request.
Mulpin Releases “Mulpin Research Laboratories Limited – The Future of Embedded Technology” – Initial Package. Click Here to Download
MULPIN US PATENT WIPO – PCT AVAILABLE FOR VIEWING….Click Here